The various components (Surface Mount Devices = SMDs) are directly bonded onto the top of a board to be mechanically fixed and electronically contacted in subsequent soldering processes.

• Screen printing
• Board assembly
• Reflow soldering
• Washing
• Assembly of special components

Designs:

• SMD down to 0201
• QFT pitch down to 400µm
• QFP, PLCC, BGA, 7x7 mm down to 50x50 mm

Substrates:

• Printed circuit board - rigid, flex, rigid-flex
• Ceramic

Solders:

• SnBi 139°
• SnPbAg2 178°
• SnAg3, 5Cu0, 75 218°