Are you building on your technological advantage to increase your ability to compete? The ideal solution for this requires the application of a large number of complex technologies?

AEMtec provides a broad range of competitive development and high end chip level technologies for the production of multi-chip modules in mixed technology. Our strength lies in a combination of SMT, COB and FC on all current substrates, such as printed circuit boards (rigid, flex-rigid), film, ceramics and wafers.

Our core business, chip-on-board technology, is a central feature of modern joining technology. Bare dies are directly positioned on a substrate in a space-saving manner and a thermally optimised state so they are fit for high-frequency operation and feature maximum reliability and cost efficiency. The goal here is to develop custom-engineered economical solutions in as little time as possible.

Multi-chip modules (MCMs) are able to handle complete functions and sub-layouts as a system in package (SIP). This allows AEMtec to support modularisation concepts, whilst also contributing to reduced manufacturing costs. For example, AEMtec is able to accommodate highly integrated modular components with many I/Os on a limited area without any need to have the entire board manufactured as an HDI-board at high cost.