COB - Chip On Board
An unpackaged chip is fixed on the substrate. The benefits compared with classic circuit board technology are: compact design, short paths, high reliability levels.
- Bonding
- Wire bonding (Al and Au wedge bonding)
- Wire bonding (Au ball bonding)
- Ribbon bonding (and)
- Pull and shear test
- Chip encapsulation
Types of bonding
- Wafers up to 8"
- Waffle pack
- Classified procedures
- Traceability with data matrix or barcode
- Programmable bond force
Wire bonding
| Al wedge bonding | Wire 18-50 µm | Pitch 80 µm |
| Au wedge bonding | Wire 18-50 µm | Pitch 80 µm |
| Au ball bonding | Wire 18-50 µm | Pitch 60 µm |
| Au ribbon bonding | Wire e.g. 50x12 µm |
Substrate
- Printed circuit board
- Ceramic
- Flex
- Wafer
