FC - Flip Chip
In the case of Flip Chip technology, the chip is soldered with the contact side face-down, directly onto the substrate. The bumps are connected with the substrate by thermo-compression bonding, soldering or gluing.
- Fluxing
- Flipping and assembly
- Reflow soldering
- Underfill
Flip Chip design types
| Flip Chip soldering | Up to 180 µm pitch |
| Isotropic conductive adhesion(ICA) | Up to 800 µm pitch |
| Anisotropic conductive adhesion (ACA) | 120µm pitch |
| Non-conductive adhesion (NCA) | 80µm pitch |
| Ultrasonic | Max. 100 stud balls |
