As with COB, optical components are directly fixed to a substrate in a bare, unpackaged state. This occurs with priority on high placement accuracy and careful handling of components (assembly of optical components, e.g. laser diodes, PIN diodes).

• Chip soldering (AuSn)
• Passive alignment of optical components
• Active fibre alignment
• Mechanical assembly
• Electro-optical testing

Procedures:

• Eutectic soldering (AuSn)
• Passice alignment 10µm
• Fibre alignment
• Hermetic sealing

Housing:

• Metal
• Plastic
• Ceramic